NO

ITEM

UNIT

VALUE

1

peel stRength

at normal condition:

after 5s heat shock

n/mm

min: 1.0

min: 1.0

2

blistering test

after 10s heat shock

no obvious blister or delamination

3

punching property

cold-punching

4

heatproof

after 60min at 130+/-2 ℃ air

no obvious blister no copper foil peel

5

copper foil resistance

mΩ

max: 3.5

6

volume resistivity

at normal condition:

after recovery through steady heat/humidity treatment:

mΩ

min: 5.0x10⁵

min: 5.0x10⁴

7

surface resistance

at normal condition:

after recovery through steady heat/humuNIdity treatment:

on etching copper foil side

min:

1.0x10⁴

min: 1.0x10³

on laminating side:

min: 1.0x10³

min: 1.0x10²

8

insulating resistance

at normal condition:

after boiling in wAter:

min: 5.0x10⁴

min: 1.0x10

9

dielectric dissipation factor

at normal condition:

after immersing in water:

max: 5.5

max: 6.0

10

permitivity

at normal condition:

after immersing in water:

max: 0.05

max: 0.01

11

laminates properties etched copper foil

flexural strength

mpa

min: 100

12

trichloroethylen and alkali resistance

appearance no obvious variety

13

falling ball impact

cm

min: 5

14

water absorption

%

max: 1.8